Profile
Mechanical engineer (BEng, SolidWorks CSWP) with 8 years of experience across product design and semiconductor capital equipment. Founded CapaDesignStudio, running daily FDM/SLA prototyping cycles across full product lifecycles. Previously at ASML, building and qualifying EUV lithography machines at Intel, TSMC and Samsung. Based in Barcelona, available immediately.
Experience
CapaDesignStudio
Founder — Design Engineer
Barcelona, Spain
Apr 2022 — Present
- Designed and developed consumer products from first sketch to shipping — CAD in SolidWorks and Blender, DfM optimisation, and final production handoff.
- Ran daily iterative prototyping cycles using FDM and SLA 3D printing; validated mechanical fit, ergonomics, and structural integrity, optimising geometry each iteration to cut print time and reduce material waste.
- Took B2B client briefs from specification through production and delivery — including custom trophies and branded assets for clients such as Playtomic.
- Maintained and optimised a fleet of 3D printers — mechanical servicing and firmware updates to keep fabrication running at full capacity.
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CapaDesignStudio · Product design & manufacturing
ASML
EUV System Integration Engineer
Global — TSMC Taiwan · Intel USA · Samsung Korea
Sep 2019 — Dec 2021
- One of two engineers globally with combined expertise across mechanical installation and machine qualification — led NXE:3600 deployments at TSMC Taiwan during COVID-19 in a hybrid role normally split across multiple specialists.
- Diagnosed complex integration failures across mechanical and software domains; authored Design Notes and Maintenance Notes to formalise field solutions for Netherlands D&E teams.
- Led machine qualification sequences including First Firings and transition to stable EUV plasma generation; progressed from trainee to shift lead within a single installation cycle.
- Calibrated the Tin Droplet Generator using PID control loops and piezoelectric actuators firing at 70 m/s, synchronised with the CO₂ laser up to 50,000 times per second to sustain continuous 13.5 nm EUV plasma generation.
- Managed and executed Site Acceptance Testing directly with customers — running metrology feedback loops and validating NA performance before sign-off on €150M+ capital equipment.
ASML · EUV system integration & machine qualification
ASML
EUV Mechanical Install Engineer
Global — Intel USA · TSMC Taiwan · Samsung Korea
Jan 2018 — Sep 2019
- Built and commissioned 15 NXE:3400 EUV systems at Intel, TSMC, and Samsung; handled equipment modules valued at €120M–150M per unit.
- Specialised in source-side integration — laser integration, optical alignment (HPAC/BTS), and UHV vessel integrity; identified and resolved technical showstoppers saving an estimated €45,000 per installation in downtime.
- Recognised as one of the top electrical troubleshooters in the field team; performed systematic fault diagnosis and module-level replacement across complex electro-mechanical systems.
- Led multidisciplinary teams of up to 6 engineers during 12–15 hour shifts; trained 20–30 international engineers using Socratic questioning to build real diagnostic ability rather than procedure-following.
ASML · EUV mechanical installation — NXE:3400 build sequence
Abbott
Mechanical Engineering Intern
Cootehill, Co. Cavan, Ireland
Apr 2015 — Sep 2015
- Developed and implemented site-wide CAD drawing standards and naming conventions; authored SOPs for specialised plant machinery.
- Supported implementation of a new Air Handling Unit for the primary production line; conducted engineering validation tests in controlled cleanroom environments.
Education
BEng — Mechanical & Energy Systems Engineering (Hons)
National University of Ireland, Galway · Sep 2012 – Sep 2017
Renewable Energy Systems, Wind Turbine Technology, Thermodynamics, Fluid Mechanics, Mechanical Design, Structural Analysis.
2012 — 2017